High (8.8) in ti omap l138 firmware. EPSS 0.2% chance of exploitation in the next 30 days.
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
Severity
CVSS 3.1
8.8 high
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:H/A:H
EPSS
0.2% chance of exploitation in the next 30 days; higher than 10% of CVEs (scores of 2026-10-31)