CVSS 3.1
7.8 highCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HCVE-2019-14093
High (7.8) in qualcomm. EPSS 0.2% chance of exploitation in the next 30 days.
Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 10% of CVEs (scores of 2026-10-31)
- CWE
- CWE-129
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:apq8009_firmware
- qualcomm:apq8017_firmware
- qualcomm:apq8053_firmware
- qualcomm:apq8096au_firmware
- qualcomm:apq8098_firmware
- qualcomm:mdm9206_firmware
- qualcomm:mdm9207c_firmware
- qualcomm:mdm9607_firmware
- qualcomm:mdm9650_firmware
- qualcomm:msm8909w_firmware
- qualcomm:msm8917_firmware
- qualcomm:msm8920_firmware
- qualcomm:msm8937_firmware
- qualcomm:msm8940_firmware
- qualcomm:msm8953_firmware
- qualcomm:msm8996_firmware
- qualcomm:msm8996au_firmware
- qualcomm:qcm2150_firmware
- qualcomm:qcs405_firmware
- qualcomm:qcs605_firmware
- qualcomm:qm215_firmware
- qualcomm:sda660_firmware
- qualcomm:sda845_firmware
- qualcomm:sdm429_firmware
- qualcomm:sdm429w_firmware
- qualcomm:sdm439_firmware
- qualcomm:sdm450_firmware
- qualcomm:sdm632_firmware
- qualcomm:sdm636_firmware
- qualcomm:sdm660_firmware
- qualcomm:sdx20_firmware