CVSS 3.1
7.1 highCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:HCVE-2019-14043
High (7.1) in qualcomm. EPSS 0.2% chance of exploitation in the next 30 days.
Out of bound read in Fingerprint application due to requested data is being used without length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Kamorta, MDM9150, MDM9205, MDM9650, MSM8998, Nicobar, QCS404, QCS405, QCS605, Rennell, SA415M, SA6155P, SC7180, SC8180X, SDA660, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 8% of CVEs (scores of 2026-10-31)
- CWE
- CWE-125
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:kamorta_firmware
- qualcomm:mdm9150_firmware
- qualcomm:mdm9205_firmware
- qualcomm:mdm9650_firmware
- qualcomm:msm8998_firmware
- qualcomm:nicobar_firmware
- qualcomm:qcs404_firmware
- qualcomm:qcs405_firmware
- qualcomm:qcs605_firmware
- qualcomm:rennell_firmware
- qualcomm:sa415m_firmware
- qualcomm:sa6155p_firmware
- qualcomm:sc7180_firmware
- qualcomm:sc8180x_firmware
- qualcomm:sda660_firmware
- qualcomm:sdm630_firmware
- qualcomm:sdm636_firmware
- qualcomm:sdm660_firmware
- qualcomm:sdm670_firmware
- qualcomm:sdm710_firmware
- qualcomm:sdm845_firmware
- qualcomm:sdm850_firmware
- qualcomm:sdx24_firmware
- qualcomm:sdx55_firmware
- qualcomm:sm6150_firmware
- qualcomm:sm7150_firmware
- qualcomm:sm8150_firmware
- qualcomm:sm8250_firmware
- qualcomm:sxr1130_firmware
- qualcomm:sxr2130_firmware