CVSS 3.1
7.8 highCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HCVE-2019-14037
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 10% of CVEs (scores of 2026-10-31)
- CWE
- CWE-416
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:apq8009_firmware
- qualcomm:apq8053_firmware
- qualcomm:apq8096au_firmware
- qualcomm:apq8098_firmware
- qualcomm:mdm9206_firmware
- qualcomm:mdm9207c_firmware
- qualcomm:mdm9607_firmware
- qualcomm:mdm9640_firmware
- qualcomm:mdm9650_firmware
- qualcomm:msm8905_firmware
- qualcomm:msm8909w_firmware
- qualcomm:msm8996_firmware
- qualcomm:msm8996au_firmware
- qualcomm:qcn7605_firmware
- qualcomm:qcn7606_firmware
- qualcomm:qcs605_firmware
- qualcomm:sc8180x_firmware
- qualcomm:sda660_firmware
- qualcomm:sda845_firmware
- qualcomm:sdm439_firmware
- qualcomm:sdm630_firmware
- qualcomm:sdm636_firmware
- qualcomm:sdm660_firmware
- qualcomm:sdm670_firmware
- qualcomm:sdm710_firmware
- qualcomm:sdm845_firmware
- qualcomm:sdx20_firmware
- qualcomm:sdx24_firmware
- qualcomm:sdx55_firmware
- qualcomm:sm8150_firmware
- qualcomm:sxr1130_firmware