CVSS 3.1
7.8 highCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HCVE-2019-13992
High (7.8) in qualcomm. EPSS 0.2% chance of exploitation in the next 30 days.
u'Out of bound memory access if stack push and pop operation are performed without doing a bound check on stack top' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Bitra, IPQ6018, IPQ8074, MDM9205, Nicobar, QCA8081, QCN7605, QCS404, QCS405, QCS605, QCS610, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 10% of CVEs (scores of 2026-10-31)
- CWE
- CWE-120
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:bitra_firmware
- qualcomm:ipq6018_firmware
- qualcomm:ipq8074_firmware
- qualcomm:mdm9205_firmware
- qualcomm:nicobar_firmware
- qualcomm:qca8081_firmware
- qualcomm:qcn7605_firmware
- qualcomm:qcs404_firmware
- qualcomm:qcs405_firmware
- qualcomm:qcs605_firmware
- qualcomm:qcs610_firmware
- qualcomm:rennell_firmware
- qualcomm:sa415m_firmware
- qualcomm:sa6155p_firmware
- qualcomm:saipan_firmware
- qualcomm:sc7180_firmware
- qualcomm:sc8180x_firmware
- qualcomm:sda845_firmware
- qualcomm:sdm670_firmware
- qualcomm:sdm710_firmware
- qualcomm:sdm845_firmware
- qualcomm:sdm850_firmware
- qualcomm:sdx20_firmware
- qualcomm:sdx24_firmware
- qualcomm:sdx55_firmware
- qualcomm:sm6150_firmware
- qualcomm:sm7150_firmware
- qualcomm:sm8150_firmware
- qualcomm:sm8250_firmware
- qualcomm:sxr1130_firmware
- qualcomm:sxr2130_firmware