CVSS 3.1
7.8 highCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HCVE-2019-10547
High (7.8) in qualcomm. EPSS 0.2% chance of exploitation in the next 30 days.
When issuing IOCTL calls to ION, Memory leak can occur due to failure in unassign pages under certain conditions in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, APQ8096AU, APQ8098, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8953, MSM8996AU, Nicobar, QCN7605, QCS605, Rennell, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM710, SDX24, SDX55, SM7150, SM8150, SM8250, SXR2130
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 8% of CVEs (scores of 2026-10-31)
- CWE
- CWE-401
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:apq8009_firmware
- qualcomm:apq8053_firmware
- qualcomm:apq8096au_firmware
- qualcomm:apq8098_firmware
- qualcomm:ipq8074_firmware
- qualcomm:mdm9206_firmware
- qualcomm:mdm9207c_firmware
- qualcomm:mdm9607_firmware
- qualcomm:mdm9640_firmware
- qualcomm:mdm9650_firmware
- qualcomm:msm8909w_firmware
- qualcomm:msm8953_firmware
- qualcomm:msm8996au_firmware
- qualcomm:nicobar_firmware
- qualcomm:qcn7605_firmware
- qualcomm:qcs605_firmware
- qualcomm:rennell_firmware
- qualcomm:saipan_firmware
- qualcomm:sc8180x_firmware
- qualcomm:sda660_firmware
- qualcomm:sda845_firmware
- qualcomm:sdm429_firmware
- qualcomm:sdm439_firmware
- qualcomm:sdm450_firmware
- qualcomm:sdm632_firmware
- qualcomm:sdm710_firmware
- qualcomm:sdx24_firmware
- qualcomm:sdx55_firmware
- qualcomm:sm7150_firmware
- qualcomm:sm8150_firmware
- qualcomm:sm8250_firmware
- qualcomm:sxr2130_firmware