CVSS 3.0
7.8 highCVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HCVE-2018-11277
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Severity
- EPSS
- 0.2% chance of exploitation in the next 30 days; higher than 6% of CVEs (scores of 2026-10-31)
- CWE
- CWE-732
- Published
- Modified
- Record from
- the NVD, synced
Affected
- qualcomm:msm8909w_firmware
- qualcomm:msm8996au_firmware
- qualcomm:sd205_firmware
- qualcomm:sd210_firmware
- qualcomm:sd212_firmware
- qualcomm:sd415_firmware
- qualcomm:sd430_firmware
- qualcomm:sd450_firmware
- qualcomm:sd615_firmware
- qualcomm:sd616_firmware
- qualcomm:sd617_firmware
- qualcomm:sd625_firmware
- qualcomm:sd650_firmware
- qualcomm:sd652_firmware
- qualcomm:sd810_firmware
- qualcomm:sd820_firmware
- qualcomm:sd820a_firmware
- qualcomm:sd835_firmware
- qualcomm:sd845_firmware
- qualcomm:sda660_firmware