{"cve":"CVE-2016-2063","nvd":{"published":"2016-08-07T21:59:04.987","modified":"2026-06-17T00:43:21.860","status":"Modified","description":"Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.","cvss_v4":null,"cvss_v3":{"version":"3.1","vector":"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H","score":7.8},"cwes":["CWE-119"],"references":["http://www.securityfocus.com/bid/92381","https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4","https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063","http://www.securityfocus.com/bid/92381","https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4"],"products":["linux:linux_kernel"],"source":"nvd","synced_at":"2026-10-19T20:40:10.783210791+00:00"},"epss":{"cve":"CVE-2016-2063","score":0.00459,"percentile":0.39789,"date":"2026-10-31"},"kev":null,"osv":[],"attribution":["This product uses the NVD API but is not endorsed or certified by the NVD.","EPSS scores: FIRST Exploit Prediction Scoring System, https://www.first.org/epss","Known exploited vulnerabilities: CISA Known Exploited Vulnerabilities Catalog, https://www.cisa.gov/known-exploited-vulnerabilities-catalog","Package advisories: OSV (https://osv.dev), from the GitHub Advisory Database, PyPA, Go, RustSec and other ecosystem databases, under CC-BY 4.0 or CC0","CVE records: the CVE Program's CVE List (https://www.cve.org), under its terms of use (https://www.cve.org/Legal/TermsOfUse). CVE is a registered trademark of The MITRE Corporation; this product is not affiliated with the CVE Program."]}